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Copper Vapor Chamber (VC) Heat Spreader
Core Material: Oxygen-free copper (C10200, ≥99.95% purity)
Thickness: 0.3-3.0mm(customizable)
Working Fluid: Deionized water, ethanol, or acetone
Process: Laser welding, vacuum brazing, plasma cleaning
Surface Finish: Electroless nickel plating(ENIG),anti-oxidation coating
Our company specializes in precision-engineered copper vapor chamber (VC) heat spreaders, a breakthrough thermal management solution designed for ultra-efficient heat dissipation in high-power electronics. Utilizing advanced phase-change technology and oxygen-free copper (OFC) construction, these VC spreaders transfer heat 5-10x faster than solid copper, eliminating hotspots in CPUs, GPUs, 5G modules, and LED arrays.
Copper VC heat spreaders combine ultra-thin profiles, vacuum-sealed reliability, and customizable geometries. Their wickless capillary structure enables passive heat redistribution at 400–1000 W/m·K thermal conductivity, making them ideal for aerospace, EV batteries, gaming hardware, and compact IoT devices.
Customizable in thickness, vapor cavity patterns, and surface coatings, our VC solutions handle thermal loads up to 500 W/cm² while reducing device temperatures by 15–30°C. Outperform traditional heat pipes and aluminum heat sinks in space-constrained applications.
Request thermal simulation reports or samples within 24 hours—optimize your thermal design with next-gen copper VC technology!
Packaging of Copper Vapor Chamber（VC）Heat Spreader
Shanghai Metal Products are packed and labeled according to the regulations and customer's requests. Great care is taken to avoid any damage which might be caused during storage or transportation. In addition, clear labels are tagged on the outside of the packages for easy identification of the product I. D. and quality information.
1) Shanghai Metal Standard
2) Customization
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