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Aluminum Liquid Metal 3D Heat Sink
Base Material 6063-T5 aluminum (anodizedceramic coated)
Coolant Eutectic GaInSn alloy (non-toxic, RoHS compliant)
Structure Laser 3D-printed micro-pillars + vacuum-sealed cavities
Thickness 0.8–5.0 mm (custom profiles)
Surface Finish Micro-grooved evaporation zones, Ni-PTFE anti-corrosion
Our company pioneers next-generation aluminum liquid metal 3D heat sinks, engineered for extreme heat flux dissipation in ultra-compact electronics. Utilizing phase-change liquid metal (GaInSn alloy) encapsulated in 6063-T5 aluminum micro-cavity structures, this solution achieves 400–600 Wm·K thermal conductivity while reducing device temperatures by 30–50°C—revolutionizing thermal management for 5G base stations, high-density servers, laser diodes, and EV power modules.
Aluminum liquid metal 3D heat sinks merge lightweight design with passive two-phase cooling. Their laser-sintered capillary channels enable gravity-independent heat spreading at 0.8–1.5 mm thickness, outperforming copper heat pipes and vapor chambers in weight-sensitive applications by 40% with no pumppower requirements.
Customizable in fin density, vapor chambers, and cold plate geometries. Handle thermal loads up to 1,000 Wcm² while slashing system weight and costs versus traditional cooling solutions.
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